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| Product Name: |
Rotatable Cylindrical Copper Cu Sputtering Target
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| Supply Ability: |
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| Related proudcts |
sputtering target, cylindrical target, |
| Specifications |
Maximum Machining Size L 4000MM T 6-13MM |
| Price Term: |
EXW,FOB,CNF,CIF |
| Port of loading: |
GUANGZHOU |
| Minimum Order |
1pcs |
| Unit Price: |
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Application: Mainly used for producing pure Cu film, widely used in Decorative glass mirror film, PCB plate, TFT-LCD, Low-E glass film, semiconductor electronics
Physical and Chemical Properties
Chemical Composition: Cu
Molding process: Spray
Purity: ¡Ý8.57g/cm3 £¨ ¡Ý 96%£©
Density: 99.9%-99.99%( according to customer requirements)
Maximum Impurities content (Unit: ppm, Total Impurities Content ¡Ü 1000ppm)
vicky-chan(at)uvtm.com |
| Company: |
UV Tech Material Ltd.
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| Contact: |
Ms. Vicky Chan |
| Address: |
No.4 Huahui Road, Huashan Town, Huadu |
| Postcode: |
510880 |
| Tel: |
86 20 22968888 |
| Fax: |
86 20 22968899 |
| E-mail: |
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